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HiSilicon Sponsorship for Mini@sic tape-out
Lucas Moura Santana (Participant)
Wambacq, P.
(Participant)
Stiens, J.
(Participant)
Faculty of Engineering
Electronics and Informatics
Activity
:
Other
›
Written proposal
Description
Application for sponsorship to cover the costs of a prototyping integrated circuit and part of my research
Period
16 Jun 2022
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