No photo of Bertrand Parvais
  • Source: Scopus
  • Calculated based on number of publications stored in Pure and citations from Scopus
20012024

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  • 2012

    3D stacked IC demonstration using a through silicon via first approach

    Van Olmen, J., Mercha, A., Katti, G., Huyghebaert, C., Van Aelst, J., Seppala, E., Chao, Z., Armini, S., Vaes, J., Teixeira Cotrin, R., Van Cauwenberghe, M., Verdonck, P., Verhemeldonck, K., Jourdain, A., Ruythooren, W., De Potter De Ten Broeck, M., Opdebeeck, A., Chiarella, T., Parvais, B., Debusschere, I. & 9 others, Hoffmann, T. Y., Stucchi, M., Rakowski, M., Soussan, P., Cartuyvels, R., Beyne, E., Biesemans, S., Swinnen, B. & Dehaene, W., 1 Dec 2012, p. 76-79. 4 p.

    Research output: Unpublished contribution to conferenceUnpublished paper

  • 2011

    3D stacked IC demonstration using a through silicon via first approach

    Van Olmen, J., Mercha, A., Katti, G., Huyghebaert, C., Van Aelst, J., Seppala, E., Chao, Z., Armini, S., Vaes, J., Teixeira Cotrin, R., Van Cauwenberghe, M., Verdonck, P., Verhemeldonck, K., Jourdain, A., Ruythooren, W., De Potter De Ten Broeck, M., Opdebeeck, A., Chiarella, T., Parvais, B., Debusschere, I. & 9 others, Hoffmann, T. Y., Stucchi, M., Rakowski, M., Soussan, P., Cartuyvels, R., Beyne, E., Biesemans, S., Swinnen, B. & Dehaene, W., 1 Dec 2011, p. 76-79. 4 p.

    Research output: Unpublished contribution to conferenceUnpublished paper

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