Embedding of optical and opto-electronic components in printed circuit boards.

Project Details


Current electronic systems experience a continuous push towards higher density in interconnections, positioning of components and more compact modules and systems. The growing complexity of the chips by the growing integration in micro-electronics fabrication increases however ever more the number of IO-channels on the chip and this put more stringent requirements of packaging technologies. The solution of "embedded chips" is a continuation along the evolution which can be observed in the packaging of chips: from the well-known DIL (Dual-in-line) packages (and similar) over the so-called surface-mount technology (with i.e. QFP (Quad flat Packs) to Chip-on-Board (COB)) where the chips are placed immediately on top of the substrate.
Beside this recent development to embed electronic chips, another trend can be observed, in particular the increasing use and integration of optical and opto-electronic components. In all kind of applications, from data and telecommunication over modules with optical sensors and reading-and writing-modules (e.g. CD, DVD,...) to applications for small display devices and signalization, one finds more and more light-emitting components, detectors and micro-optical components in combination with electronic components and connections.
This project application aims at the research towards a useful technology that fulfills both of these trends, in particular embedding optic and opto-electronic chips in substrates and printed circuit boards (PCBs). Two important things have to be kept in mind:
1. Solutions being pursued should, in order to finally breakthrough, be completely compatible with the current technologies for the fabrication of PCBs. This means that the used embedding-technology must make use materials which are compatible with pressures and temperatures that are common during production of FR4-based PCBs and with existing mounting & assembling techniques for electronic components.
2. To fully exploit the advantages of the embedding electronic chips, namely as a packaging technique driven towards its limits this implies for optic and optoelectronic chips the embedding technique has to be able to provide an optical window, just like the classical packaging techniques, with if necessary built-in micro-optic elements, alignation structures and hermetic sealing.
Effective start/end date1/01/0831/12/08

Flemish discipline codes

  • Other engineering and technology


  • physics