Generic 3D micro-structured optical waveguide interconnect platform for photonic integrated circuits

Project Details


Photonic integrated circuits (PICs) are revolutionizing science and
technology with their compact size, high performance, and wide
range of applications. Because it is now clear that no single material
platform can provide all the desired functionalities, a combination of
PIC platforms is often required. Current hybrid integration solutions
often rely on custom on-chip coupling features which require a
specialty fabrication process and/or make use of fragile photonic wire
bonds fabricated by 3D direct laser writing (DLW). In this project I
propose a generic solution that uses an interposer based on polymer
micro-structured optical waveguides (MOWs) fabricated by 3D DLW.
This approach does not rely on custom on-chip features, is
independent of the chip’s waveguide geometry, is mechanically more
robust and is not susceptible to contamination. In addition, it enables
additional functionalities, such as polarization control and minimal
bending losses. I will demonstrate the potential of this platform by
accurately designing the MOWs, fabricating them with the cuttingedge 3D DLW technology, and bring it all together in a final proof-ofconcept demonstrator which aims at creating a high-performance
hybrid integrated travelling-wave mode-locked pulsed laser by
interconnecting two different PICs. By doing so, I will not only
advance the scientific knowledge in the 3D DLW of photonic
components, but I will also initiate a paradigm shift in the field of
hybrid photonic integration..
Effective start/end date1/10/2230/09/25


  • 2-photon polymerization-based direct laser writin
  • Micro-structured optical waveguides
  • Optical interconnects

Flemish discipline codes in use since 2023

  • Photonics, optoelectronics and optical communications


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