Modelling and Characterisation of Advanced Packaging Technologies for High-speed and High-frequency Components, Circuits and Systems.

Project Details


In collaboration with Prof. Paul Lagasse (UG). Developing of modellisation techniques for electromagnetic behaviour of 3-dimentional structures, including the integration into the new generation circuit-simulator like "Impulse" of Hewlett-Packard. On wafer testing-(UG) Research of a formalism able to describe had non-linearities in a circuit simulator-based on experimental measurements including advanced frequency domain and time domain measurements and ccrrection models (VUB).
Effective start/end date1/12/9331/12/97


  • electricty

Flemish discipline codes in use since 2023

  • Electrical and electronic engineering


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