Abstract
In this paper, a 30 kW three-phase T-type active front end (AFE) topology is presented and the effect of layout on the parasitic inductance and thermal
performance is assessed for modular off-board charging systems. According to the operation time, a mean time between failure (MTBF) is calculated for the variation of junction temperature. According to the analysis the peak junction
temperature is calculated as 80◦C. In order to find a compromise between cooling and layout, a parametric study is performed in ANSYS Q3D for 3 different layouts with different semiconductor distances. The cooling system is then designed and several analyses are performed to achieve the layout with minimal parasitic inductance while satisfying the system lifetime key performance indicator. Finally, the layout Case2A with 10mm semiconductor separation is selected as the optimal design. The parasitic loops are calculated as 33.9 nH and 43.7 nH for the upper and lower loop, respectively. The peak junction temperature is calculated as 76.7◦C which is slightly below the thermal limit.
performance is assessed for modular off-board charging systems. According to the operation time, a mean time between failure (MTBF) is calculated for the variation of junction temperature. According to the analysis the peak junction
temperature is calculated as 80◦C. In order to find a compromise between cooling and layout, a parametric study is performed in ANSYS Q3D for 3 different layouts with different semiconductor distances. The cooling system is then designed and several analyses are performed to achieve the layout with minimal parasitic inductance while satisfying the system lifetime key performance indicator. Finally, the layout Case2A with 10mm semiconductor separation is selected as the optimal design. The parasitic loops are calculated as 33.9 nH and 43.7 nH for the upper and lower loop, respectively. The peak junction temperature is calculated as 76.7◦C which is slightly below the thermal limit.
| Original language | English |
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| Title of host publication | 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) |
| Publisher | IEEE |
| Number of pages | 8 |
| ISBN (Electronic) | 9789075815412 |
| DOIs | |
| Publication status | Published - 4 Sep 2023 |
Publication series
| Name | 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe |
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Bibliographical note
Funding Information:Acknowledgements: This work was supported by HiEFFICIENT project. This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey. The authors also acknowledge Flanders Make for the support to the MOBI research group.
Publisher Copyright:
© 2023 EPE Association.