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3D technologies for analog/RF applications
A. Vandooren, B. Parvais, L. Witters, A. Walke, A. Vais, C. Merckling, D. Lin, N. Waldron, P. Wambacq, D. Mocuta, N. Collaert
Research output: Chapter in Book/Report/Conference proceeding › Conference paper
3
Citations
(Scopus)