3D technologies for analog/RF applications

A. Vandooren, B. Parvais, L. Witters, A. Walke, A. Vais, C. Merckling, D. Lin, N. Waldron, P. Wambacq, D. Mocuta, N. Collaert

Research output: Chapter in Book/Report/Conference proceedingConference paper

3 Citations (Scopus)


Dive into the research topics of '3D technologies for analog/RF applications'. Together they form a unique fingerprint.

Engineering & Materials Science