Projects per year
Abstract
Analog and RF circuit performance in single-chip transceivers can severely suffer from coupling of digital switching noise to the silicon substrate To predict this performance degradation, a deeper understanding of the impact of substrate noise is absolutely necessary. Using measurements, this impact is studied as the cascade of an attenuation through the substrate from the source of substrate noise to the RF circuit and the propagation through the RF circuit to its output This approach has been validated with measurements on a 0.25 mum and a 0.18 mum CMOS low-noise. amplifier (LNA) and reveals insight in the mechanisms of impact of substrate noise on RF circuits. In addition, impact of a real digital circuit is measured on a 0.18 mum differential CMOS LNA
Original language | English |
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Title of host publication | 20th IEEE Instrumentation and Measurement Technology Conference |
Publisher | IEEE, 345 E 47TH ST, NEW YORK |
Pages | 1303-1308 |
Number of pages | 6 |
ISBN (Print) | 0-7803-7705-2 |
Publication status | Published - 20 May 2003 |
Event | Finds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet - Stockholm, Sweden Duration: 21 Sept 2009 → 25 Sept 2009 |
Conference
Conference | Finds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet |
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Country/Territory | Sweden |
City | Stockholm |
Period | 21/09/09 → 25/09/09 |
Bibliographical note
IMTC/2003, Proceedings of the 20th IEEE Instrumentation and Measurement Technology Conference, Vail, Colorado, USA, 20-22 May, 2003, pp. 1303-1308Fingerprint
Dive into the research topics of 'Characterization of Substrate Noise Impact on RF CMOS Integrated Circuits in Lightly Doped Substrates'. Together they form a unique fingerprint.Projects
- 1 Finished
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IWT151: A project of mixed-signals for 5GHz WPAN transceivers.
1/01/02 → 31/12/05
Project: Fundamental