Characterization of Substrate Noise Impact on RF CMOS Integrated Circuits in Lightly Doped Substrates

Charlotte Soens, C. Crunelle, P. Wambacq, Gerd Vandersteen, S. Donnay, Yves Rolain, Maarten Kuijk, Alain Barel

Research output: Chapter in Book/Report/Conference proceedingConference paper

10 Citations (Scopus)

Abstract

Analog and RF circuit performance in single-chip transceivers can severely suffer from coupling of digital switching noise to the silicon substrate To predict this performance degradation, a deeper understanding of the impact of substrate noise is absolutely necessary. Using measurements, this impact is studied as the cascade of an attenuation through the substrate from the source of substrate noise to the RF circuit and the propagation through the RF circuit to its output This approach has been validated with measurements on a 0.25 mum and a 0.18 mum CMOS low-noise. amplifier (LNA) and reveals insight in the mechanisms of impact of substrate noise on RF circuits. In addition, impact of a real digital circuit is measured on a 0.18 mum differential CMOS LNA
Original languageEnglish
Title of host publication20th IEEE Instrumentation and Measurement Technology Conference
PublisherIEEE, 345 E 47TH ST, NEW YORK
Pages1303-1308
Number of pages6
ISBN (Print)0-7803-7705-2
Publication statusPublished - 20 May 2003
EventFinds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet - Stockholm, Sweden
Duration: 21 Sept 200925 Sept 2009

Conference

ConferenceFinds and Results from the Swedish Cyprus Expedition: A Gender Perspective at the Medelhavsmuseet
Country/TerritorySweden
CityStockholm
Period21/09/0925/09/09

Bibliographical note

IMTC/2003, Proceedings of the 20th IEEE Instrumentation and Measurement Technology Conference, Vail, Colorado, USA, 20-22 May, 2003, pp. 1303-1308

Fingerprint

Dive into the research topics of 'Characterization of Substrate Noise Impact on RF CMOS Integrated Circuits in Lightly Doped Substrates'. Together they form a unique fingerprint.

Cite this