Comparative Thermal Analysis of Cooling Methods for Dual Inverter Applications in Electric Vehicles

Research output: Chapter in Book/Report/Conference proceedingConference paper

4 Citations (Scopus)

Abstract

Electric vehicles (EVs) have gained global attention as a solution to climate change and pollution caused by internal combustion engine vehicles (ICEVs). However, the limited driving range and long charging time pose challenges for EVs. Higher power density and efficiency in power electronic systems can increase the driving range of EVs. Advancements in power electronics for EVs have led to higher power density integration and smaller components. Therefore, effective thermal management solutions are crucial to maintaining device temperatures within acceptable limits for higher power densities. This research aims to investigate and compare the thermal cooling efficiency and pressure drop of different liquid cooling methods (serial and parallel cooling) for dual inverter applications based on SiC MOSFETs.Extensive evaluations have been conducted using Ansys Fluent software for Computational Fluid Dynamics (CFD) simulations. The study emphasizes the benefits of parallel cooling with reduced pressure drop, offering enhanced heat dissipation, higher power density, and optimized thermal management
Original languageEnglish
Title of host publication 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
Place of PublicationAalborg, Denmark
PublisherIEEE
Number of pages6
ISBN (Electronic)978-9-0758-1541-2
ISBN (Print)979-8-3503-1678-0
DOIs
Publication statusPublished - 2 Oct 2023
EventEPE 2023 ECCE Europe - Aalborg, Denmark
Duration: 4 Sept 20238 Sept 2023

Publication series

Name2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe

Conference

ConferenceEPE 2023 ECCE Europe
Country/TerritoryDenmark
CityAalborg
Period4/09/238/09/23

Bibliographical note

Funding Information:
VII. ACKNOWLEDGEMENT This work was supported by HiEFFICIENT project. This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281.The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey. The authors also acknowledge Flanders Make for the support to the MOBI research group.

Publisher Copyright:
© Copyright 2023 IEEE - All rights reserved.

Keywords

  • Thermal management
  • Finite-element analysis
  • Design
  • SiC MOSFET
  • Electric Vehicle (EV)

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