Abstract
Electric vehicles (EVs) have gained global attention as a solution to climate change and pollution caused by internal combustion engine vehicles (ICEVs). However, the limited driving range and long charging time pose challenges for EVs. Higher power density and efficiency in power electronic systems can increase the driving range of EVs. Advancements in power electronics for EVs have led to higher power density integration and smaller components. Therefore, effective thermal management solutions are crucial to maintaining device temperatures within acceptable limits for higher power densities. This research aims to investigate and compare the thermal cooling efficiency and pressure drop of different liquid cooling methods (serial and parallel cooling) for dual inverter applications based on SiC MOSFETs.Extensive evaluations have been conducted using Ansys Fluent software for Computational Fluid Dynamics (CFD) simulations. The study emphasizes the benefits of parallel cooling with reduced pressure drop, offering enhanced heat dissipation, higher power density, and optimized thermal management
| Original language | English |
|---|---|
| Title of host publication | 2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) |
| Place of Publication | Aalborg, Denmark |
| Publisher | IEEE |
| Number of pages | 6 |
| ISBN (Electronic) | 978-9-0758-1541-2 |
| ISBN (Print) | 979-8-3503-1678-0 |
| DOIs | |
| Publication status | Published - 2 Oct 2023 |
| Event | EPE 2023 ECCE Europe - Aalborg, Denmark Duration: 4 Sept 2023 → 8 Sept 2023 |
Publication series
| Name | 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe |
|---|
Conference
| Conference | EPE 2023 ECCE Europe |
|---|---|
| Country/Territory | Denmark |
| City | Aalborg |
| Period | 4/09/23 → 8/09/23 |
Bibliographical note
Funding Information:VII. ACKNOWLEDGEMENT This work was supported by HiEFFICIENT project. This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281.The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey. The authors also acknowledge Flanders Make for the support to the MOBI research group.
Publisher Copyright:
© Copyright 2023 IEEE - All rights reserved.
Keywords
- Thermal management
- Finite-element analysis
- Design
- SiC MOSFET
- Electric Vehicle (EV)
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