TY - GEN
T1 - Device-, Circuit-Block-level evaluation of CFET in a 4 track library
AU - Schuddinck, P.
AU - Zografos, O.
AU - Weckx, P.
AU - Matagne, P.
AU - Sarkar, S.
AU - Sherazi, Y.
AU - Baert, R.
AU - Jang, D.
AU - Yakimets, D.
AU - Gupta, A.
AU - Parvais, B.
AU - Ryckaert, J.
AU - Verkest, D.
AU - Mocuta, A.
PY - 2019/6/1
Y1 - 2019/6/1
N2 - The structure of the complementary FET (CFET) with NMOS stacked on top of PMOS, inherently yields standard cells and SRAM cells with 25% smaller layout area, 25% higher pin density and 2x higher routing flexibility than FinFET with same overall active footprint. Moreover, our work, based on advanced modelling, demonstrates that 4 track CFET can match and even outperform 5 track FinFET; without the need to lower S/D contact resistivity down to 5e-10Ωcm2 or to elevate the channel stress up to 2GPa. All gains in power-performance-area at circuit-level are maintained at block-level, making 4 track CFET a suitable candidate for N3 N2 technologies. Keywords: CFET, scaling, S/D engineering, Pi-gate.
AB - The structure of the complementary FET (CFET) with NMOS stacked on top of PMOS, inherently yields standard cells and SRAM cells with 25% smaller layout area, 25% higher pin density and 2x higher routing flexibility than FinFET with same overall active footprint. Moreover, our work, based on advanced modelling, demonstrates that 4 track CFET can match and even outperform 5 track FinFET; without the need to lower S/D contact resistivity down to 5e-10Ωcm2 or to elevate the channel stress up to 2GPa. All gains in power-performance-area at circuit-level are maintained at block-level, making 4 track CFET a suitable candidate for N3 N2 technologies. Keywords: CFET, scaling, S/D engineering, Pi-gate.
UR - http://www.scopus.com/inward/record.url?scp=85070269024&partnerID=8YFLogxK
U2 - 10.23919/VLSIT.2019.8776513
DO - 10.23919/VLSIT.2019.8776513
M3 - Conference paper
AN - SCOPUS:85070269024
T3 - Digest of Technical Papers - Symposium on VLSI Technology
SP - T204-T205
BT - 2019 Symposium on VLSI Technology, VLSI Technology 2019 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 39th Symposium on VLSI Technology, VLSI Technology 2019
Y2 - 9 June 2019 through 14 June 2019
ER -