From 5G to 6G: Will compound semiconductors make the difference?

N. Collaert, A. Alian, A. Banerjee, V. Chauhan, R. Y. Elkashlan, B. Hsu, M. Ingels, A. Khaled, K. Vondkar Kodandarama, B. Kunert, Y. Mols, U. Peralagu, V. Putcha, R. Rodriguez, A. Sibaja-Hernandez, E. Simoen, A. Vais, A. Walke, L. Witters, S. YadavH. Yu, M. Zhao, P. Wambacq, B. Parvais, N. Waldron

Research output: Chapter in Book/Report/Conference proceedingConference paper

5 Citations (Scopus)

Abstract

In this work, we will address the opportunities of a hybrid III-V/CMOS technology for next generation wireless communication, beyond 5G, moving to operating frequencies above 100GHz. Challenges related to III-V upscaling and CMOS co-integration using 3D technologies will be discussed.

Original languageEnglish
Title of host publication2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings
EditorsShaofeng Yu, Xiaona Zhu, Ting-Ao Tang
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (Electronic)9781728162355
DOIs
Publication statusPublished - 3 Nov 2020
Event15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Virtual, Kunming, China
Duration: 3 Nov 20206 Nov 2020

Publication series

Name2020 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020 - Proceedings

Conference

Conference15th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2020
CountryChina
CityVirtual, Kunming
Period3/11/206/11/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Copyright:
Copyright 2021 Elsevier B.V., All rights reserved.

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