TY - GEN
T1 - Low-voltage scaled 6T FinFET SRAM cells
AU - Collaert, N.
AU - Von Arnim, K.
AU - Rooyackers, R.
AU - Vandeweyer, T.
AU - Mercha, A.
AU - Parvais, B.
AU - Witters, L.
AU - Nackaerts, A.
AU - Sanchez, E. Altamirano
AU - Demand, M.
AU - Hikavyy, A.
AU - Demuynck, S.
AU - Devriendt, K.
AU - Bauer, F.
AU - Ferain, I.
AU - Veloso, A.
AU - De Meyer, K.
AU - Biesemans, S.
AU - Jurczak, M.
PY - 2010/11/15
Y1 - 2010/11/15
N2 - Planar bulk devices suffer from high random dopant fluctuations (RDF) when scaled down to sub-32 nm technology nodes. This is considered as a major roadblock for the integration of these devices in high density 6T SRAM cells [1, 2]. The increasing variation of transistor parameters like VT, ION, IOFF, etc., can result in a large variability in performance and power. The possibility of leaving the channels undoped and their excellent immunity against Short Channel Effects (SCE) favors the use of FinFET-based multi-gate devices [3] for these technology nodes.
AB - Planar bulk devices suffer from high random dopant fluctuations (RDF) when scaled down to sub-32 nm technology nodes. This is considered as a major roadblock for the integration of these devices in high density 6T SRAM cells [1, 2]. The increasing variation of transistor parameters like VT, ION, IOFF, etc., can result in a large variability in performance and power. The possibility of leaving the channels undoped and their excellent immunity against Short Channel Effects (SCE) favors the use of FinFET-based multi-gate devices [3] for these technology nodes.
UR - http://www.scopus.com/inward/record.url?scp=78651537461&partnerID=8YFLogxK
U2 - 10.1007/978-90-481-9379-0_4
DO - 10.1007/978-90-481-9379-0_4
M3 - Conference paper
AN - SCOPUS:78651537461
SN - 9789048193783
T3 - Lecture Notes in Electrical Engineering
SP - 55
EP - 66
BT - Emerging Technologies and Circuits
T2 - International Conference on Integrated Circuit Design and Technology, ICICDT 2008
Y2 - 2 June 2008 through 4 June 2008
ER -