Skip to main navigation Skip to search Skip to main content

Low-voltage scaled 6T FinFET SRAM cells

N. Collaert, K. Von Arnim, R. Rooyackers, T. Vandeweyer, A. Mercha, B. Parvais, L. Witters, A. Nackaerts, E. Altamirano Sanchez, M. Demand, A. Hikavyy, S. Demuynck, K. Devriendt, F. Bauer, I. Ferain, A. Veloso, K. De Meyer, S. Biesemans, M. Jurczak

Research output: Chapter in Book/Report/Conference proceedingConference paper

1 Citation (Scopus)

Abstract

Planar bulk devices suffer from high random dopant fluctuations (RDF) when scaled down to sub-32 nm technology nodes. This is considered as a major roadblock for the integration of these devices in high density 6T SRAM cells [1, 2]. The increasing variation of transistor parameters like VT, ION, IOFF, etc., can result in a large variability in performance and power. The possibility of leaving the channels undoped and their excellent immunity against Short Channel Effects (SCE) favors the use of FinFET-based multi-gate devices [3] for these technology nodes.

Original languageEnglish
Title of host publicationEmerging Technologies and Circuits
Pages55-66
Number of pages12
DOIs
Publication statusPublished - 15 Nov 2010
EventInternational Conference on Integrated Circuit Design and Technology, ICICDT 2008 - Grenoble, France
Duration: 2 Jun 20084 Jun 2008

Publication series

NameLecture Notes in Electrical Engineering
Volume2021 LNEE
ISSN (Print)1876-1100
ISSN (Electronic)1876-1119

Conference

ConferenceInternational Conference on Integrated Circuit Design and Technology, ICICDT 2008
Country/TerritoryFrance
CityGrenoble
Period2/06/084/06/08

Fingerprint

Dive into the research topics of 'Low-voltage scaled 6T FinFET SRAM cells'. Together they form a unique fingerprint.

Cite this