Multi-scale modeling of direct copper plating on resistive non-copper substrates

Liu Yang, Aleksandar Radisic, Magi Nagar, Johan Deconinck, Leonardus Leunissen, Philippe Vereecken, Alan West

Research output: Chapter in Book/Report/Conference proceedingMeeting abstract (Book)

17 Citations (Scopus)


Direct copper plating on resistive non-Cu substrates has been studied as an optional electroplating methods for advanced interconnect. Existing experimental studies, as well as modeling works, have covered various aspects. In a direct plating process, copper deposition starts with nucleation on a foreign substrate. Individual nuclei are formed and eventually coalesce with each other to form a continuous film. This coalescence process starts at the wafer edge and propagates toward the wafer center until the whole wafer is covered by copper. As both macro (cm scale) and micro (nm scale) phenomena are involved, a multi-scale modeling approach is developed in this study to simulate the direct plating process.
Original languageEnglish
Title of host publication222nd Meeting of ECS
Publication statusPublished - 7 Oct 2012
EventUnknown -
Duration: 7 Oct 2012 → …

Publication series

Name222nd Meeting of ECS


Period7/10/12 → …


  • copper


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