On the Use of Laplace and Warburg Variables for Heat Diffusion Modeling

Research output: Chapter in Book/Report/Conference proceedingConference paper

1 Citation (Scopus)

Abstract

The modeling of heat diffusion phenomena is important to develop optimal control strategies for ground coupled heat pump systems. This paper will discuss different model extraction techniques for such heat diffusion problems, namely using rational transfer function models in both the Laplace and the Warburg domain. The experimental verification is done using measurements on the heat diffusion problem in an isolated bar. The best rational transfer function models in the Laplace variable s and in the Warburg variable ?s are compared, demonstrating that the Warburg domain has better predicting capabilities when it comes to predicting the lower frequency behavior of the system
Original languageEnglish
Title of host publication10th International Conference on Environment and Electrical Engineering, Rome, Italy , 8-11 May 2011
Publication statusPublished - 8 May 2011
EventUnknown -
Duration: 8 May 2011 → …

Conference

ConferenceUnknown
Period8/05/11 → …

Keywords

  • Heat Diffusion Modeling

Fingerprint

Dive into the research topics of 'On the Use of Laplace and Warburg Variables for Heat Diffusion Modeling'. Together they form a unique fingerprint.

Cite this