Thermal Concept Design of MOSFET Power Modules in Inverter Subsystems for Electric Vehicles

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38 Citations (Scopus)

Abstract

The most important key in the thermal management of power electronic devices is the cooling system design. One of the most promising cooling techniques is indirect liquid cooling using cold plates. This paper studies the performance of a liquid cooling system on the junction temperature of a high-power inverter drive utilizing three legs of half-bridge modules (CAS120M12BM2 Silicon Carbide CREE MOSFET). One of the primary objectives is to compare the effect of different geometries and boundary conditions on the thermal performances regarded as maximum junction temperature. Based on the analysis of the liquid cooling, different boundary conditions are proposed and a comparison of the main case study is made against the case of different geometries and boundary conditions. Furthermore, the concept of varying the distance between three half-bridge MOSFETs in an inverter drive is introduced. According to the simulation results, in the best combination, the maximum junction temperature of the module is decreased to 82.2°C when the thermal paste and NX100 materials are selected for the thermal interface material and the heat sink, respectively. In addition, Simulation results show that the best distance between each of the modules in the inverter drive is 10mm spacing.
Original languageEnglish
Title of host publicationInternational Conference on Power and Energy Systems
PublisherIEEE
Number of pages6
ISBN (Electronic)9781728126586
DOIs
Publication statusPublished - 10 Dec 2019
Event9th International Conference on Power and Energy Systems - Murdoch University, Perth, Australia
Duration: 10 Dec 201912 Dec 2019
http://icpes.org

Publication series

Name2019 9th International Conference on Power and Energy Systems, ICPES 2019

Conference

Conference9th International Conference on Power and Energy Systems
Abbreviated titleICPES 2019
Country/TerritoryAustralia
CityPerth
Period10/12/1912/12/19
Internet address

Keywords

  • Thermal management
  • power electronics device
  • Inverter
  • MOSFET modules
  • Electric Vehicle

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