Abstract

Advancement in the field of power electronics has led to substantial increase in power density integration and reduction in component size. This leads to high heat flux
dissipation at the chip level. This study aims to demonstrate thermal management and cooling methods for power electronics to dissipate heat.
Original languageEnglish
Publication statusPublished - 30 Mar 2022
EventFlanders Make - 2022 Scientific Conference - Flanders Expo, Ghent, Belgium
Duration: 30 Mar 2022 → …

Conference

ConferenceFlanders Make - 2022 Scientific Conference
CountryBelgium
CityGhent
Period30/03/22 → …

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