Thermal Management for Power Electronics

Gamze Egin Martin; Mohamed El Baghdadi; Omar Hegazy

Thermal Management for Power Electronics

Gamze Egin Martin, Mohamed El Baghdadi, Omar Hegazy

Research output: Unpublished contribution to conference › Poster

Abstract

Advancement in the field of power electronics has led to substantial increase in power density integration and reduction in component size. This leads to high heat flux
dissipation at the chip level. This study aims to demonstrate thermal management and cooling methods for power electronics to dissipate heat.

Original language	English
Publication status	Published - 30 Mar 2022
Event	Flanders Make - 2022 Scientific Conference - Flanders Expo, Ghent, Belgium Duration: 30 Mar 2022 → …

Conference

Conference	Flanders Make - 2022 Scientific Conference
Country	Belgium
City	Ghent
Period	30/03/22 → …

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title = "Thermal Management for Power Electronics",

abstract = "Advancement in the field of power electronics has led to substantial increase in power density integration and reduction in component size. This leads to high heat fluxdissipation at the chip level. This study aims to demonstrate thermal management and cooling methods for power electronics to dissipate heat.",

author = "{Egin Martin}, Gamze and {El Baghdadi}, Mohamed and Omar Hegazy",

year = "2022",

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AU - Egin Martin, Gamze

AU - El Baghdadi, Mohamed

AU - Hegazy, Omar

PY - 2022/3/30

Y1 - 2022/3/30

N2 - Advancement in the field of power electronics has led to substantial increase in power density integration and reduction in component size. This leads to high heat fluxdissipation at the chip level. This study aims to demonstrate thermal management and cooling methods for power electronics to dissipate heat.

AB - Advancement in the field of power electronics has led to substantial increase in power density integration and reduction in component size. This leads to high heat fluxdissipation at the chip level. This study aims to demonstrate thermal management and cooling methods for power electronics to dissipate heat.

M3 - Poster

ER -

Thermal Management for Power Electronics

Abstract

Conference

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