Thin-film 850 nm light emitters on fiber optic face plate

P. Heremans; Maarten Kuijk; Marc Peeters; Reiner Windisch; Dave Filkins; Gustaaf Borghs

Thin-film 850 nm light emitters on fiber optic face plate

P. Heremans, Maarten Kuijk, Marc Peeters, Reiner Windisch, Dave Filkins, Gustaaf Borghs

Research output: Chapter in Book/Report/Conference proceeding › Conference paper › Research

Abstract

The light emitted by 850 nm sources is absorbed by the GaAs substrate on which such sources are grown. Therefore, when such sources have to be flip-chip mounted on a carrier such as a CMOS chip, the GaAs substrate has to be removed completely. We present a novel concept for fabricating such thin-film bottom-emitting 850 nm sources, in which we use a fiber optic face plate as a new host substrate. We reveal experimental details about the first realization of arrays of such devices, and assess their properties

Original language	English
Title of host publication	25th European Conference on Optical Communication.ECOC
Publisher	Soc. Electr. Electron, Paris, Fra
Pages	304-305
Number of pages	2
Volume	2
ISBN (Print)	2-912328-12-8
Publication status	Published - 26 Sep 2000
Event	Unknown - Duration: 26 Sep 2000 → …

Conference

Conference	Unknown
Period	26/09/00 → …

Bibliographical note

25th European Conference on Optical Communication.ECOC , Vol. 98, pp. 315 -316.

Keywords

CMOS integrated circuits
flip-chip devices
fiber optic face
flip-chip mounted

Cite this

@inproceedings{453fc2d280614c559c23fc0cf94cbc8e,

title = "Thin-film 850 nm light emitters on fiber optic face plate",

abstract = "The light emitted by 850 nm sources is absorbed by the GaAs substrate on which such sources are grown. Therefore, when such sources have to be flip-chip mounted on a carrier such as a CMOS chip, the GaAs substrate has to be removed completely. We present a novel concept for fabricating such thin-film bottom-emitting 850 nm sources, in which we use a fiber optic face plate as a new host substrate. We reveal experimental details about the first realization of arrays of such devices, and assess their properties",

keywords = "CMOS integrated circuits, flip-chip devices, fiber optic face, flip-chip mounted",

author = "P. Heremans and Maarten Kuijk and Marc Peeters and Reiner Windisch and Dave Filkins and Gustaaf Borghs",

note = "25th European Conference on Optical Communication.ECOC , Vol. 98, pp. 315 -316.; null ; Conference date: 26-09-2000",

year = "2000",

month = sep,

day = "26",

language = "English",

isbn = "2-912328-12-8",

volume = "2",

pages = "304--305",

booktitle = "25th European Conference on Optical Communication.ECOC",

publisher = "Soc. Electr. Electron, Paris, Fra",

}

TY - GEN

T1 - Thin-film 850 nm light emitters on fiber optic face plate

AU - Heremans, P.

AU - Kuijk, Maarten

AU - Peeters, Marc

AU - Windisch, Reiner

AU - Filkins, Dave

AU - Borghs, Gustaaf

N1 - 25th European Conference on Optical Communication.ECOC , Vol. 98, pp. 315 -316.

PY - 2000/9/26

Y1 - 2000/9/26

N2 - The light emitted by 850 nm sources is absorbed by the GaAs substrate on which such sources are grown. Therefore, when such sources have to be flip-chip mounted on a carrier such as a CMOS chip, the GaAs substrate has to be removed completely. We present a novel concept for fabricating such thin-film bottom-emitting 850 nm sources, in which we use a fiber optic face plate as a new host substrate. We reveal experimental details about the first realization of arrays of such devices, and assess their properties

AB - The light emitted by 850 nm sources is absorbed by the GaAs substrate on which such sources are grown. Therefore, when such sources have to be flip-chip mounted on a carrier such as a CMOS chip, the GaAs substrate has to be removed completely. We present a novel concept for fabricating such thin-film bottom-emitting 850 nm sources, in which we use a fiber optic face plate as a new host substrate. We reveal experimental details about the first realization of arrays of such devices, and assess their properties

KW - CMOS integrated circuits

KW - flip-chip devices

KW - fiber optic face

KW - flip-chip mounted

M3 - Conference paper

SN - 2-912328-12-8

VL - 2

SP - 304

EP - 305

BT - 25th European Conference on Optical Communication.ECOC

PB - Soc. Electr. Electron, Paris, Fra

Y2 - 26 September 2000

ER -

Thin-film 850 nm light emitters on fiber optic face plate

Abstract

Conference

Bibliographical note

Keywords

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Cite this