Wafer-level package interconnect options

Jayaprakash Balachandran, Steven Brebels, G. Carchon, Maarten Kuijk, Walter De Raedt, B. Nauwelaers, Eric Beyne

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

As integrated circuit technology enters the nanometer era, global interconnects are becoming a bottleneck for overall chip performance. In this paper, we show that wafer-level package interconnects are an effective alternative to conventional on-chip global wires. These interconnects behave as LC transmission lines and can be exploited for their near speed of tight transmission and low attenuation characteristics. We compare performance measures such as bandwidth, bandwidth density, latency, and power consumption of the package-level transmission lines with conventional on-chip global interconnects for different International Technology Roadmap for Semiconductors (ITRS) technology nodes. Based on these results, we show that package-level interconnects are well suited for power demanding low-latency applications. We also analyze different interconnect options such as memory buses, long inter tile interconnects, clock, and power distribution
Original languageEnglish
Pages (from-to)654-659
Number of pages6
JournalIEEE Transactions on very large scale integration (VLSI) Systems
Volume14
Issue number6
Publication statusPublished - 1 Jun 2006

Keywords

  • Electronics
  • global interconnects
  • package
  • performance metrics
  • transmission lines

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