Projecten per jaar
Persoonlijk profiel
Opleiding / Academische kwalificatie
electrical engineering, Ph.D
Externe posities
principal member of the technical staff, Interuniversitair Micro-Elektronica Centrum
1 jan 2005 → …Vingerafdruk
Verdiep u in de onderzoeksgebieden waarop Bertrand Parvais actief is. Deze onderwerplabels komen uit het werk van deze persoon. Samen vormen ze een unieke vingerafdruk.
- 1 Soortgelijke profielen
Netwerk
Recente externe samenwerking op landen-/regioniveau. Duik in de details door op de stippen te klikken of
Projecten
- 1 Actief
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IOF3016: GEAR: Zich wagen aan toekomstige gezondheidstechnologieën
Stiens, J., Wambacq, P., da Silva Gomes, B. T., Sahli, H., Vandemeulebroucke, J., Jansen, B., Lemeire, J., Steenhaut, K., Munteanu, A., Deligiannis, N., Schelkens, P., Kuijk, M., Parvais, B., Chan, C. W., Van Schependom, J., Touhafi, A., Braeken, A., Runacres, M., Cornelis, B., Schretter, C., Blinder, D. & Temmermans, F.
1/01/21 → 24/12/25
Project: Toegepast
Onderzoeksoutput
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A 28nm 6.5-8.1GHz 1.16mW/qubit Cryo-CMOS System-on-Chip for Superconducting Qubit Readout
Winckel, S. V., Caglar, A., Gys, B., Brebels, S., Potocnik, A., Parvais, B., Wambacq, P. & Craninckx, J., 19 sep 2022, ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC). IEEE, blz. 61-64 4 blz. (ESSCIRC 2022 - IEEE 48th European Solid State Circuits Conference, Proceedings).Onderzoeksoutput: Conference paper
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Channel Thickness Impact on the Small- and Large-Signal RF Performance of GaN HEMTs on Si with a cGaN Back-Barrier
ElKashlan, R., Khaled, A., Rodriguez, R., Yadav, S., Peralagu, U., Alian, A., Collaert, N., Wambacq, P. & Parvais, B., 29 aug 2022, 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022. Denver, CO, USA: Institute of Electrical and Electronics Engineers Inc., blz. 910-913 4 blz.Onderzoeksoutput: Conference paper
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Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer
Alian, A., Rodriguez, R., Yadav, S., Peralagu, U., Sibaja-Hernandez, A., Putcha, V., Zhao, M., ElKashlan, R., Vermeersch, B., Yu, H., Bury, E., Khaled, A., Collaert, N. & Parvais, B., 18 nov 2022, ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC). Institute of Electrical and Electronics Engineers Inc., blz. 384-387 4 blz.Onderzoeksoutput: Conference paper
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Linearity Assessment of GaN HEMTs on Si using Nonlinear Characterisation
ElKashlan, R., Khaled, A., Rodriguez, R., Putcha, V., Peralagu, U., Alian, A., Collaert, N., Wambacq, P. & Parvais, B., 3 apr 2022, 2021 16th European Microwave Integrated Circuits Conference (EuMIC). IEEE, blz. 30-33 4 blz. (EuMIC 2021 - 2021 16th European Microwave Integrated Circuits Conference).Onderzoeksoutput: Conference paper
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A BSIM-Based Predictive Hot-Carrier Aging Compact Model
Xiang, Y., Tyaginov, S., Vandemaele, M., Wu, Z., Franco, J., Bury, E., Truijen, B., Parvais, B., Linten, D. & Kaczer, B., mrt 2021, 2021 IEEE International Reliability Physics Symposium, IRPS 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 9405222. (IEEE International Reliability Physics Symposium Proceedings; vol. 2021-March).Onderzoeksoutput: Conference paper