3D technologies for analog/RF applications

A. Vandooren, B. Parvais, L. Witters, A. Walke, A. Vais, C. Merckling, D. Lin, N. Waldron, P. Wambacq, D. Mocuta, N. Collaert

Onderzoeksoutput: Conference paper

3 Citaten (Scopus)

Samenvatting

In this work, we will review possible technology options for next generation wireless communication. Next to the introduction of specific device architectures and materials, dissimilar from standard Si CMOS, the challenge will lie in the co-integration of these non-Si technologies with CMOS to enable power efficient systems with high performance, in this case high speed and output power, and reduced form factor. Next to monolithic integration, sequential 3D, currently been investigated for LOGIC density scaling, can be one of the enablers, allowing to combine technologies with very different needs at a finer grain and thus higher density than traditional 3D-SOC and 3D-IC technologies.

Originele taal-2English
Titel2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
UitgeverijInstitute of Electrical and Electronics Engineers Inc.
Pagina's1-3
Aantal pagina's3
Volume2018-March
ISBN van elektronische versie9781538637654
ISBN van geprinte versie9781538637654
DOI's
StatusPublished - 7 mrt 2018
Evenement2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017 - Burlingame, United States
Duur: 16 okt 201718 okt 2017

Publicatie series

Naam2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
Volume2018-March

Conference

Conference2017 IEEE SOI-3D-Subthreshold Microelectronics Unified Conference, S3S 2017
LandUnited States
StadBurlingame
Periode16/10/1718/10/17

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