A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems: Challenges and possibilities

Abhitosh Vais; Annie Kumar; Guillaume Boccardi; Sachin Yadav; Yves Mols; Reynald Alcotte; Bjorn Vermeersch; Marc Ingels; Uthayasankaran Peralagu; Cesar Roda Neve; Bruno Ghyselen; Bertrand Parvais; Piet Wambacq; Bernardette Kunert; Nadine Collaert

A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems: Challenges and possibilities

Abhitosh Vais, Annie Kumar, Guillaume Boccardi, Sachin Yadav, Yves Mols, Reynald Alcotte, Bjorn Vermeersch, Marc Ingels, Uthayasankaran Peralagu, Cesar Roda Neve, Bruno Ghyselen, Bertrand Parvais, Piet Wambacq, Bernardette Kunert, Nadine Collaert

Onderzoeksoutput: Chapter › peer review

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III-V semiconductor-based devices, in particular InP heterojunction bipolar transistors, are a strong contender for next-generation high-speed communication systems. In this paper, we present motivation for the upscaling of III-V technology on to 300 mm Si platforms. A comparison of various options for such III-V on Si technology is described. The challenges in the way to achieve its integration into existing CMOS platform and possibilities to overcome them are shown. We describe imec's path to demonstrate a CMOS compatible III-V-on-300 mm Si technology with the most recent results.

Originele taal-2	English
Titel	Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications
Uitgeverij	River Publishers
Pagina's	27-40
Aantal pagina's	14
ISBN van elektronische versie	9788770046640
ISBN van geprinte versie	9788770046657
Status	Published - 22 aug 2024

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Publisher Copyright:
© 2024 River Publishers.

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Link naar publicatie in Scopus

SRP78: SRP-Onderzoekszwaartepunt: Centrum voor modelgebaseerde systeemverbetering - Van computerondersteunde engineering tot model ondersteunde engineering
Vandersteen, G., Rolain, Y., Wambacq, P. & Kuijk, M.
1/11/22 → 31/10/27
Project: Fundamenteel

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Vais, A., Kumar, A., Boccardi, G., Yadav, S., Mols, Y., Alcotte, R., Vermeersch, B., Ingels, M., Peralagu, U., Roda Neve, C., Ghyselen, B., Parvais, B., Wambacq, P., Kunert, B., & Collaert, N. (2024). A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems: Challenges and possibilities. In Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications (blz. 27-40). River Publishers.

Vais, Abhitosh ; Kumar, Annie ; Boccardi, Guillaume ; Yadav, Sachin ; Mols, Yves ; Alcotte, Reynald ; Vermeersch, Bjorn ; Ingels, Marc ; Peralagu, Uthayasankaran ; Roda Neve, Cesar ; Ghyselen, Bruno ; Parvais, Bertrand ; Wambacq, Piet ; Kunert, Bernardette ; Collaert, Nadine. / A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems : Challenges and possibilities. Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications. River Publishers, 2024. blz. 27-40

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abstract = "III-V semiconductor-based devices, in particular InP heterojunction bipolar transistors, are a strong contender for next-generation high-speed communication systems. In this paper, we present motivation for the upscaling of III-V technology on to 300 mm Si platforms. A comparison of various options for such III-V on Si technology is described. The challenges in the way to achieve its integration into existing CMOS platform and possibilities to overcome them are shown. We describe imec's path to demonstrate a CMOS compatible III-V-on-300 mm Si technology with the most recent results.",

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Vais, A, Kumar, A, Boccardi, G, Yadav, S, Mols, Y, Alcotte, R, Vermeersch, B, Ingels, M, Peralagu, U, Roda Neve, C, Ghyselen, B, Parvais, B , Wambacq, P, Kunert, B & Collaert, N 2024, A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems: Challenges and possibilities. in Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications. River Publishers, blz. 27-40.

A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems : Challenges and possibilities. / Vais, Abhitosh; Kumar, Annie; Boccardi, Guillaume; Yadav, Sachin; Mols, Yves; Alcotte, Reynald; Vermeersch, Bjorn; Ingels, Marc; Peralagu, Uthayasankaran; Roda Neve, Cesar; Ghyselen, Bruno; Parvais, Bertrand ; Wambacq, Piet; Kunert, Bernardette; Collaert, Nadine.

Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications. River Publishers, 2024. blz. 27-40.

Onderzoeksoutput: Chapter › peer review

TY - CHAP

T1 - A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems

T2 - Challenges and possibilities

AU - Vais, Abhitosh

AU - Kumar, Annie

AU - Boccardi, Guillaume

AU - Yadav, Sachin

AU - Mols, Yves

AU - Alcotte, Reynald

AU - Vermeersch, Bjorn

AU - Ingels, Marc

AU - Peralagu, Uthayasankaran

AU - Roda Neve, Cesar

AU - Ghyselen, Bruno

AU - Parvais, Bertrand

AU - Wambacq, Piet

AU - Kunert, Bernardette

AU - Collaert, Nadine

PY - 2024/8/22

Y1 - 2024/8/22

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AB - III-V semiconductor-based devices, in particular InP heterojunction bipolar transistors, are a strong contender for next-generation high-speed communication systems. In this paper, we present motivation for the upscaling of III-V technology on to 300 mm Si platforms. A comparison of various options for such III-V on Si technology is described. The challenges in the way to achieve its integration into existing CMOS platform and possibilities to overcome them are shown. We describe imec's path to demonstrate a CMOS compatible III-V-on-300 mm Si technology with the most recent results.

KW - 6G

KW - HBT

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PB - River Publishers

ER -

A CMOS compatible III-v-on-300 mm SI technology for future high-speed communication systems: Challenges and possibilities

Samenvatting

Bibliografische nota

Andere bestanden en links

Projecten

SRP78: SRP-Onderzoekszwaartepunt: Centrum voor modelgebaseerde systeemverbetering - Van computerondersteunde engineering tot model ondersteunde engineering

Citeer dit