A dataset of high-resolution synchrotron x-ray photoelectron spectra of tarnished silver-copper surfaces before and after reduction with a remote helium plasma at atmospheric pressure

Olivier Schalm, Alessandro Patelli, Patrick Storme, Amandine Crabbé, Stefano Voltolina, Vitaliy Feyer, Herman Terryn

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The data presented in this article are related to the measurements in the contribution titled: ‘Tarnished silver-copper surfaces reduction using remote helium plasma at atmospheric pressure studied by means of high-resolution synchrotron x-ray photoelectron microscopy’ published in Corrosion Science. X-ray photoelectron spectra were collected from pure silver, sterling silver (92.5 w% Ag and 7.5 w% Cu) alloy and pure copper. These metals were artificially sulphidised. A remote helium plasma at atmospheric pressure was applied on the metallic and sulphidised state. Then the top layer of the 4 surface states were analysed at the NanoESCA beamline (Electron Spectroscopy for Chemical Analysis at the Nanoscale) at Elettra Sincrotrone Trieste. The instrument installed as an end station at the NanoESCA beamline of the Elettra storage ring combines an electrostatic Photo Electron Emission Microscope (PEEM) with a double-hemispherical (‘IDEA’) analyser, allowing the collection of photoemission electron microscopy (PEEM) images, X-ray photo electron-energy-filtered images and XPS spectra. The NanoESCA beamline provides electromagnetic radiation with variable polarization (linear, circular) and energies up to 1000 eV. Information for Cu3p, Cl2p, S2p, C1s and Ag3d were obtained by collecting spectra at 450 eV. The goal of the analyses was to determine how the plasma treatment changed the top layer of the metallic and sulphidised surface of pure silver, sterling silver and pure copper. This contribution focuses on the calibration of the collected XPS spectra, as well as the impact of the plasma treatment on the surface states.

Originele taal-2English
Artikelnummer106872
Pagina's (van-tot)106872
Aantal pagina's13
TijdschriftData in Brief
Volume35
DOI's
StatusPublished - apr 2021

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© 2021 The Authors.

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