Active Thermal Control of a DC-DC Converter Using Dynamic Gate-drive for Reliability Improvement

Onderzoeksoutput: Conference paper

Samenvatting

In this article, a new approach for smoothing junction temperature fluctuations through active thermal control is proposed. By utilizing a current-source gate drive and controlling switching transition, switching losses can be regulated in a way to control junction temperature swing which is a dominant reason of wear-out failure mechanisms in MOSFETs. The simulation results indicate a 29% increase in lifetime. Additionally, the experimental results demonstrate the capability of this approach to control the junction temperature of a MOSFET effectively.

Originele taal-2English
Titel2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
UitgeverijIEEE
Pagina's1-8
Aantal pagina's8
ISBN van elektronische versie978-9-0758-1541-2
ISBN van geprinte versie979-8-3503-1678-0
DOI's
StatusPublished - 2 okt 2023
Evenement2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe) - Aalborg, Denmark
Duur: 4 sep 20238 sep 2023

Publicatie series

Naam2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe

Conference

Conference2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe)
Land/RegioDenmark
StadAalborg
Periode4/09/238/09/23

Bibliografische nota

Publisher Copyright:
© 2023 EPE Association.

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