Active Thermal Control of a WBG-based AC-DC Converter Using Dynamic Gate-drive for Lifetime Improvement

Onderzoeksoutput: Conference paperResearch

Samenvatting

In this paper, an advanced method for implementing active thermal control is proposed that can be helpful for smoothing repetitive junction temperature swing, which is one of the main reasons for wear-out failure in Wide bandgap (WBG)-based (i.e., SiC) power electronics converters (PEC). Utilizing current-source gate-drive, rise/fall (tON/tOFF) time during switching transition can be controlled, resulting in shaping switching losses in the form that can minimize junction temperature swings. The proposed method is implemented for an AC-DC converter and the simulation results validate the performance of the proposed method. It shows that by reducing junction temperature swing by 7°C, the lifetime of the PEC can be improved by a factor of 2.

Originele taal-2English
TitelIECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society
UitgeverijIEEE
Aantal pagina's6
ISBN van elektronische versie978-1-6654-8025-3
ISBN van geprinte versie978-1-6654-8026-0
DOI's
StatusPublished - 9 dec 2022
Evenement48th Annual Conference of the IEEE Industrial Electronics Society
IECON 2022 : Conference session- Power Electronics & Energy Conversion
- Brussels, Brussels, Belgium
Duur: 17 okt 202220 okt 2022
https://iecon2022.org/conference-program/

Publicatie series

NaamIECON Proceedings (Industrial Electronics Conference)
Volume2022-October

Conference

Conference48th Annual Conference of the IEEE Industrial Electronics Society
IECON 2022
Verkorte titelIECON2022
Land/RegioBelgium
StadBrussels
Periode17/10/2220/10/22
Internet adres

Bibliografische nota

Funding Information:
VII. ACKNOWLEDGEMENT This work was supported by HiEFFICIENT project. This project has received funding from the ECSEL Joint Undertaking (JU) under grant agreement no. 101007281. The JU receives support from the European Union’s Horizon 2020 research and innovation program and Austria, Germany, Slovenia, Netherlands, Belgium, Slovakia, France, Italy, and Turkey.

Publisher Copyright:
© 2022 IEEE.

Copyright:
Copyright 2022 Elsevier B.V., All rights reserved.

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