TY - JOUR
T1 - Experimental Characterization & Electro-Thermal Modeling of Double Side Cooled SiC MOSFETs for Accurate and Rapid Power Converter Simulations
AU - Dini, Pierpaolo
AU - Saponara, Sergio
AU - Chakraborty, Sajib
AU - Hosseinabadi, Farzad
AU - Hegazy, Omar
N1 - Publisher Copyright:
© 2013 IEEE.
Copyright:
Copyright 2023 Elsevier B.V., All rights reserved.
PY - 2023/7/24
Y1 - 2023/7/24
N2 - The paper presents a precise and efficient model of Double-Side Cooled (DSC) SiC MOSFET, which incorporates the dynamics of both electrical and thermal variables. It offers a suitable computational complexity for simulating transients in complex power converters. The objective is to define a model that enables multi-scale time simulations and facilitates rapid power converter design in system-level tools such as Simulink. Additionally, the model aims to achieve simulation accuracy comparable to device-level models for the next generation of SiC MOSFETs. The paper demonstrates the complete test bench measurement procedure for the device. This procedure is essential for experimentally extrapolating the intrinsic characteristics and developing a model-reduction approach based on electro-thermal modeling. The approach strikes a balance between computational complexity and level of detail. The proposed model has been seamlessly integrated into Simulink to simulate a 3-phase inverter for several grid cycles at the grid frequency. To evaluate the model’s validity, the predicted inverter performance is compared with experimental measurements. These simulations require significantly less time compared to those based on LTspice models.
AB - The paper presents a precise and efficient model of Double-Side Cooled (DSC) SiC MOSFET, which incorporates the dynamics of both electrical and thermal variables. It offers a suitable computational complexity for simulating transients in complex power converters. The objective is to define a model that enables multi-scale time simulations and facilitates rapid power converter design in system-level tools such as Simulink. Additionally, the model aims to achieve simulation accuracy comparable to device-level models for the next generation of SiC MOSFETs. The paper demonstrates the complete test bench measurement procedure for the device. This procedure is essential for experimentally extrapolating the intrinsic characteristics and developing a model-reduction approach based on electro-thermal modeling. The approach strikes a balance between computational complexity and level of detail. The proposed model has been seamlessly integrated into Simulink to simulate a 3-phase inverter for several grid cycles at the grid frequency. To evaluate the model’s validity, the predicted inverter performance is compared with experimental measurements. These simulations require significantly less time compared to those based on LTspice models.
UR - http://www.scopus.com/inward/record.url?scp=85165913240&partnerID=8YFLogxK
U2 - 10.1109/ACCESS.2023.3298526
DO - 10.1109/ACCESS.2023.3298526
M3 - Article
VL - 11
SP - 79120
EP - 79143
JO - IEEE Access
JF - IEEE Access
SN - 2169-3536
ER -