Lifetime and Cost Analysis of DC-DC Solid State Transformers for Wind Applications

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Lifetime assessment of high-power solid state transformer (SST) is a challenging task due to many factors affecting their lifespan. High-power SSTs are more complex than their low-power counterparts since more components are required in their design. This adds another challenge to the lifetime assessment. In the literature, SSTs are studied but their lifetime assessment is not covered. Moreover, the relationship between lifetime and converter cost is missing. This paper investigates the lifetime and material cost properties of modular SiC MOSFET-based DC/DC SSTs for offshore wind farm applications. The variation in cost and lifetime is investigated based on four different design variables. These four design variables are the submodule topology of the SST, the number of parallel semiconductor switches, the high blocking voltage of semiconductor switches, and the cooling type of the SST. Comparative results indicate that the best lifetime and cost results are obtained utilizing a dual-active half-bridge (DAHB) topology, a single semiconductor switch in parallel, a 2000 V switch operating voltage, and forced air cooling.
Originele taal-2English
Titel2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)
UitgeverijIEEE
Pagina's611-618
Aantal pagina's8
ISBN van elektronische versie9798350387599
ISBN van geprinte versie9798350387605
DOI's
StatusPublished - 21 jun 2024
Evenement2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM) - Ischia, Napoli, Italy
Duur: 19 jun 202421 jun 2024
https://www.speedam.org/

Publicatie series

Naam2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion, SPEEDAM 2024

Conference

Conference2024 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM)
Verkorte titelSPEEDAM
Land/RegioItaly
StadNapoli
Periode19/06/2421/06/24
Internet adres

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Publisher Copyright:
© 2024 IEEE.

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